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                    UL /IEC/ EN 60950 Test Probe Kits BND-TPK01

                    Product Description:UL /IEC/ EN 60950 IEC61032 Test Probe KitsModel:BND-TPK01Product Details:The BND-TPK-01 contains the devices listed in the core of the UL / IEC / EN 60950 requirements. It includes the following:· IEC Jointed Finger Probe (w/ banana jack in handle) (BND-B)· 50mm Impact Test Ball (BND-G500R)
                    Description

                    Product Description:

                    UL /IEC/ EN 60950 IEC61032 Test Probe Kits

                    Model:BND-TPK01


                    Product Details:

                    The BND-TPK-01 contains the devices listed in the core of the UL / IEC / EN 60950 requirements. It includes the following:

                    · IEC Jointed Finger Probe (w/ banana jack in handle) (BND-B)

                    · 50mm Impact Test Ball (BND-G500R)

                    · Test Pin Probe: short (BND-13)

                    · Rigid Finger Probe (BND-11)

                    · Ball Pressure Tester (BND-QY102)

                    · Telecom Test Probe (BND-TB12)

                    Meets Requirements for Testing Standard(s) including but not limited to:IEC 60950EN 60950UL 60950CSA 950


                    Datasheets of BND-TPK01 test probe kit:


                    test probe B 1.jpgIEC61032  IEC60950  IEC60335
                    IEC60529  IEC60045  IEC60884
                    IEC60745
                    Knurled Finger Diameter:12mm
                    Knurled Finger Length:80mm
                    Baffle Plate Diameter:50mm
                    Baffle Plate Length:100mm
                    Baffle Thickness:20mm
                    BND-G500R
                    Test Sphere 500G with ring
                     2.jpgIEC61032  IEC60529Diameter:50mm
                    Weight:227g
                    BND-13
                    Short Test Pin
                     3.jpgIEC60065
                    IEC60335
                    IEC61032
                    The probe Diameter:Head 3mm Tail 4mm
                    The probe Length:15mm
                    Dam-board Diameter:25mm
                    Dam-board Thickness:4mm
                    BND-11
                    Rigid Test Probe 11
                     4.jpgIEC61032
                    IEC60065
                    IEC60335
                    IEC60884
                    Nodular Finger Length:80mm
                    Nodular Finger Diameter:12mm
                    Dam-board Diameter:50mm
                    Dan-board Thickness:5mm
                    BND-TB12
                    12mm Telecom Test Probe
                     5.jpgIEC60065 IEC60695 IEC60950Probe Diameter:12mm
                    Probe Length:80mm
                    Baffle Plate Diameter:50mm
                    BND-QY102
                    Ball Pressure Apparatus
                     6.jpgIEC60695-10-2 IEC60884
                    IEC60320 IEC60335
                    IEC60598
                    IEC60950
                    Ball diameter:5MM
                    Total test pressure:20N±0.2N
                    Samples bearing Diameter:50mm,Length:100mm Solid stainless steel cylinder



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